Apple does two things that are very expensive:
- They use a huge physical area of silicon for their high performance chips. The “Pro” line of M chips have a die size of around 280 square mm, the “Max” line is about 500 square mm, and the “Ultra” line is possibly more than 1000 square mm. This is incredibly expensive to manufacture and package.
- They pay top dollar to get the exclusive rights to TSMC’s new nodes. They lock up the first year or so of TSMC’s manufacturing capacity at any given node, at which point there is enough capacity to accommodate other designs from other TSMC clients (AMD, NVIDIA, Qualcomm, etc.). That means you can just go out and buy an Apple device made from TSMC’s latest node before AMD or Qualcomm have even announced the lines that will be using those nodes.
Those are business decisions that others simply can’t afford to follow.
800 is reticle, they’re not past that, it doesn’t make sense.
They chiplet past 500, the economics break down otherwise.
They chiplet past 500
I don’t know if I’m using the right vocabulary, maybe “die size” is the wrong way to describe it. But the Ultra line packages two Max SoCs with a high performance interconnect, so that the whole package does use about 1000 mm^2 of silicon.
My broader point is that much of Apple’s performance comes from their willingness to actually use a lot of silicon area to achieve that performance, and it’s very expensive to do so.
You could say total die size, but you wouldn’t say die, that implies a single cut exposure of silicon.
But agreed, Apple just took all the tricks Intel dabbled with and turned them to 11, Intel was always too cheap because they had crazy volumes (and once upon a time had a good process) and there was no point.
